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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC., , , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)Hot-LEGO: Architect Microfluidic Cooling Equipped 3DIC with Pre-RTL Thermal Simulation., , , and . IGSC, page 14-17. ACM, (2023)Thermal Performance Analysis of Mempool RISC-V Multicore SoC., , , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 30 (11): 1668-1676 (2022)Power and Thermal Modeling of In-3D-Memory Computing., , , , , and . ISDCS, page 1-4. IEEE, (2021)Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation., , , and . CoRR, (2024)An ultra low-power and area-efficient baseband processor for WBAN transmitter., , , , and . APSIPA, page 1-4. IEEE, (2013)Size Optimization Design for Cantilever Structure of an Ammunition Supply Truck Based on Optistruct., , , and . CACRE, page 69:1-69:5. ACM, (2019)A model for nonlinear cost problems in optimal design of communication networks., , and . ICCCN, page 516-519. IEEE, (2000)A Policy Model and Framework for Context-Aware Access Control to Information Resources., , , , and . CoRR, (2017)A 1.5-D Multi-Channel EEG Compression Algorithm Based on NLSPIHT., , , and . IEEE Signal Process. Lett., 22 (8): 1118-1122 (2015)