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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.

S. Venkateswarlu, S. Mishra, H. Oprins, B. Vermeersch, M. Brunion, J. Han, M. Stan, D. Biswas, P. Weckx, and F. Catthoor. IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)

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Saskia Björn

Bolli Björnsson

Gerhild Bjornson

Ulf Björner

Anders Jørgen Bjørndalen

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Influence of substrate thickness on thermal impedance of microelectronic structures.B. Vermeersch, and G. Mey. Microelectron. Reliab., 47 (2-3): 437-443 (2007)Thermal impedance plots of micro-scaled devices.B. Vermeersch, and G. Mey. Microelectron. Reliab., 46 (1): 174-177 (2006)Influence of thermal contact resistance on thermal impedance of microelectronic structures.B. Vermeersch, and G. Mey. Microelectron. Reliab., 47 (8): 1233-1238 (2007)Dynamic thermal modelling of a power integrated circuit with the application of structure functions.M. Janicki, J. Banaszczyk, G. Mey, M. Kaminski, B. Vermeersch, and A. Napieralski. Microelectron. J., 40 (7): 1135-1140 (2009)Towards accurate temperature prediction in BEOL for reliability assessment (Invited).M. Lofrano, H. Oprins, X. Chang, B. Vermeersch, O. Pedreira, A. Lesniewska, V. Cherman, I. Ciofi, K. Croes, S. Park and 1 other author(s). IRPS, page 1-7. IEEE, (2023)Dynamic electrothermal simulation of integrated resistors at device level.B. Vermeersch, and G. Mey. Microelectron. J., 40 (9): 1411-1416 (2009)Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.S. Venkateswarlu, S. Mishra, H. Oprins, B. Vermeersch, M. Brunion, J. Han, M. Stan, D. Biswas, P. Weckx, and F. Catthoor. IEEE Trans. Very Large Scale Integr. Syst., 31 (12): 1896-1904 (December 2023)almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials.J. Carrete, B. Vermeersch, A. Katre, A. van Roekeghem, T. Wang, G. Madsen, and N. Mingo. Comput. Phys. Commun., (2017)Thermal Performance Analysis of Mempool RISC-V Multicore SoC.S. Venkateswarlu, S. Mishra, H. Oprins, B. Vermeersch, M. Brunion, J. Han, M. Stan, P. Weckx, and F. Catthoor. IEEE Trans. Very Large Scale Integr. Syst., 30 (11): 1668-1676 (2022)Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses.M. Janicki, J. Banaszczyk, B. Vermeersch, G. Mey, and A. Napieralski. Microelectron. Reliab., 51 (8): 1351-1355 (2011)

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Disambiguation of "Vermeersch, Bjorn"

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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.

Please choose a person to relate this publication to

Saskia Björn

Bolli Björnsson

Gerhild Bjornson

Ulf Björner

Anders Jørgen Bjørndalen

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Vermeersch, Bjorn"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.

Please choose a person to relate this publication to

Saskia Björn

Bolli Björnsson

Gerhild Bjornson

Ulf Björner

Anders Jørgen Bjørndalen

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.