Author of the publication

Testing the Limits: Unusual Text Inputs Generation for Mobile App Crash Detection with Large Language Model.

, , , , , , , and . CoRR, (2023)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Fill in the Blank: Context-aware Automated Text Input Generation for Mobile GUI Testing., , , , , , and . ICSE, page 1355-1367. IEEE, (2023)Testing the Limits: Unusual Text Inputs Generation for Mobile App Crash Detection with Large Language Model., , , , , , , and . CoRR, (2023)Chatting with GPT-3 for Zero-Shot Human-Like Mobile Automated GUI Testing., , , , , , , and . CoRR, (2023)Fill in the Blank: Context-aware Automated Text Input Generation for Mobile GUI Testing., , , , , , and . CoRR, (2022)A Tale of Two Tasks: Automated Issue Priority Prediction with Deep Multi-task Learning., , , , , , and . ESEM, page 1-11. ACM, (2022)Make LLM a Testing Expert: Bringing Human-like Interaction to Mobile GUI Testing via Functionality-aware Decisions., , , , , , , and . CoRR, (2023)Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)., , , , , and . 3DIC, page 1-6. IEEE, (2011)Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products., , , , and . Microelectron. Reliab., 52 (11): 2701-2708 (2012)Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending., , and . Microelectron. Reliab., 51 (9-11): 1850-1855 (2011)Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis., , and . Microelectron. Reliab., (2016)