Author of the publication

Substitution or Complement: An Empirical Analysis on the Impact of Collaborative Tagging on Web Search.

, , , , and . Web Intelligence, page 757-760. IEEE Computer Society, (2006)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Ab-initio Calculations of the Vibrational Properties of Nanostructures., and . High Performance Computing in Science and Engineering, Springer, (2011)Monocular based lane-change on scaled-down autonomous vehicles., , , , , , and . Intelligent Vehicles Symposium, page 144-149. IEEE, (2011)Modeling and optimization oriented to the micro-grid-EV joint system., , , and . ICNC-FSKD, page 336-341. IEEE, (2016)Geometric-process-based battery management modeling and optimization in the electric vehicle battery switching station., , , and . ICNC, page 897-901. IEEE, (2015)Accurate Switching Performance Prediction and Characterization For Wide Range, High Frequency SiC High Voltage Generator., , and . IECON, page 5101-5106. IEEE, (2019)Unbalanced and Low-Order Harmonic Voltage Mitigation of Stand-Alone Dual-Stator Brushless Doubly Fed Induction Wind Generator., , , and . IEEE Trans. Ind. Electron., 65 (11): 9135-9146 (2018)Recent Advances and Challenges in the Seismo-Electromagnetic Study: A Brief Review., , and . Remote. Sens., 14 (22): 5893 (2022)Determination of Epicenters before Earthquakes Utilizing Far Seismic and GNSS Data: Insights from Ground Vibrations., , , , , , , , , and 5 other author(s). Remote. Sens., 12 (19): 3252 (2020)A new head pose tracking method based on stereo visual SLAM., , , , , , , and . J. Vis. Commun. Image Represent., (2022)Quantitative Evaluation of the Topologies and Electromagnetic Performances of Dual-Three-Phase Flux-Switching Machines., , and . IEEE Trans. Ind. Electron., 65 (11): 9157-9167 (2018)